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asmt-mxk0 moonstone tm 1w power led light source on mcpcb data sheet description 1w power led light source is a high performance energy efcient device which can handle high thermal and high driving current. the exposed pad design has excellent heat transfer from the package to the motherboard. the 1w power led light source is mounted on to metal core pcb enabling optimum heat dissipation and ease of installation. the low profle package design is suitable for a wide variety of applications especially where height is a constraint. applications ? portable (fash light, bicycle head light) ? reading light ? architectural lighting ? garden lighting ? decorative lighting features ? available in red, amber, green, blue, cool white and warm white color. ? energy efcient ? high current operation. ? long operation life. ? wide viewing angle. ? silicone encapsulation specifcations ? allngap technology for red and amber ? ingan technology for green, blue, cool white and warm white color ? 2.4v, 350ma (typical) for alingap technology ? 3.6v, 350 ma (typical) for ingan technology ? 110 viewing angle for white products ? 120 viewing angle for mono color products
2 package dimensions notes: 1. all dimensions in millimeters 2. tolerance is 0.1mm unless otherwise specifed.
3 device selection guide at junction temperature t j = 25c color part number luminous flux, v [1,2,3] (lm) test current dice technology min typ max (ma) red asmt-mrk0 25.5 40.0 56.0 350 alingap amber asmt-mak0 25.5 35.0 43.0 350 alingap green asmt-mgk0 43.0 60.0 73.0 350 ingan blue asmt-mbk0 11.5 15.0 25.5 350 ingan cool white asmt-mwk0 43.0 60.0 73.0 350 ingan warm white asmt-myk0 43.0 50.0 73.0 350 ingan notes: 1. v is the total luminous fux output as measured with an integrating sphere at 25ms mono pulse condition. 2. flux tolerance is 10 % 3. v data are only applicable for asmt-mx00 component level device only. part numbering system absolute maximum ratings [4] at t a = 25c parameters asmt - mx ko units dc forward current [5] 350 ma peak pulsing current [6] 500 ma power dissipation for allngap 1050 mw power dissipation for ingan 1400 mw led junction temperature for allngap 120 c led junction temperature for ingan 110 c operating ambient temperature range -40 to + 85 c storage temperature range -40 to + 100 c note: 4. absolute maximum rating data are only applicable for asmt-mx00 component level device only. 5. dc forward current C derate linearly based on figure 5 for alingap & figure 11 for ingan. 6. pulse condition duty factor = 10%, frequency = 1khz. asmt- m x ko -x 1 x 2 x 3 color bin selection max flux bin selection min flux bin selection color b - b lue g - g r ee n w - c ool w hit e y - warm white
4 optical characteristics [1] (t a = 25 c) part number color peak wavelength f peak (nm) dominant wavelength f d [2] (nm) viewing angle 2 ? [3] (degrees) luminous efciency (lm/w) typ. typ. typ. typ. asmt-mrk0 red 635 625 120 48 asmt-mak0 amber 598 590 120 42 asmt-mgk0 green 519 525 120 48 asmt-mbk0 blue 460 467 120 12 part number color correlated color temperature, cct (kelvin) viewing angle 2 ? [2] (degrees) luminous efciency (lm/w) min max typ typ asmt-mwk0 cool white 4000 10000 110 48 asmt-myk0 warm white 2600 4000 110 40 notes: 1. optical characteristics data are only applicable for asmt-mx00 component level device only. 2. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the device. 3. ? is the of-axis angle where the luminous intensity is ? the peak intensity. electrical characteristic [4] (t a = 25 c) forward voltage v f (volts) @ i f = 350ma reverse voltage v r (volts) thermal resistance r j-b (c/w) [5] dice type min typ max. max. typ. alingap 2.0 2.4 3.0 5 12 ingan 3.2 3.6 4.0 5 18 note: 4. electrical characteristic data are only applicable for asmt-mx00 component level device only. 5. r j-b is thermal resistance from led junction to mcpcb.
5 0 50 100 150 200 250 300 350 400 450 500 0.00 0.50 1.00 1.50 2.00 2.50 3.00 forward voltage - v forward current - ma 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -70 -50 -30 -10 10 30 50 70 90 off-axis angle() relative intensity 0 50 100 150 200 250 300 350 400 0 10 20 30 40 50 60 70 80 90 t a ambient temperature - c i f max forward current - ma 0 0.5 1 1.5 2 -40 -25 -10 5 20 35 50 65 80 95 110 junction temperature - ?c relative lop (normalized at 25?c) red amber r ja = 50c/w r ja = 40c/w r ja = 30c/w 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity red amber 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 50 100 150 200 250 300 350 400 450 500 mono pulse current - ma relative luminous flux ( v) - lm figure 1. relative intensity vs. wavelength for alingap figure 2. forward current vs forward voltage for alingap figure 3. relative luminous flux vs. mono pulse current for alingap figure 4. radiation pattern for alingap figure 5. maximum forward current vs. ambient temperature for alingap figure 6. relative lop (normalized at 25 c) vs. junction temperature for derated based on t j max = 120c, r ja = 30c/w / 40c/w and 50c/w alingap
6 0 50 100 150 200 250 300 350 400 0 10 20 30 40 50 60 70 80 90 t a ambient temperature - c i f max forward current - ma 0 50 100 150 200 250 300 350 400 0 10 20 30 40 50 60 70 80 90 450 460 470 480 490 500 510 520 530 540 100 150 200 250 300 350 400 forward current - ma dominant wavelength - nm green blue 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 0 50 100 150 200 250 300 350 400 450 500 mono pulse current - ma relative luminous flux (v) - lm 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -90 -70 -50 -30 -10 10 30 50 70 90 off-axis angle () relative intensity green blue cool white warm white 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity green blue cool white warm white 0 50 100 150 200 250 300 350 400 450 500 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 forward voltage - v forward current - ma r ja = 30c/w r ja = 40c/w r ja = 50c/w figure 7. relative intensity vs. wavelength for ingan figure 8. forward current vs forward voltage for ingan figure 9. relative luminous flux vs. mono pulse current for ingan figure 10. radiation pattern for ingan figure 11. maximum forward current vs. ambient temperature for ingan figure 12. dominant wavelength vs. forward current C ingan devices derated based on t j max = 110c, r ja = 30c/w / 40c/w and 50c/w
7 0.000 0.002 0.004 0.006 0.008 0.010 0.012 0.014 0.016 0.000 0.001 0.002 0.003 0.004 0.005 0.006 0.007 0.008 x-coordinates y-coordinates 100ma 350ma 300ma 250ma 150ma -300 -250 -200 -150 -100 -50 0 50 100 150 200 250 300 -40 -15 10 35 60 85 temperature - c relative forward voltage shift (mv) 0 0.5 1 1.5 2 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 junction temperature - c relative lop (%) normalized at 25?c green blue cool white warm white figure 13. chromaticity shift vs. current figure 14. temperature vs. relative forward voltage shift *note: (x,y) values @ 350ma reference to (0.0) figure 15. relative lop vs. junction temperature for ingan note: all parametric charts are only applicable for asmt-mx00 component level device only
8 bin flux (lm) at 350ma min max a 5.5 7.0 b 7.0 9.0 c 9.0 11.5 d 11.5 15.0 e 15.0 19.5 f 19.5 25.5 g 25.5 33.0 h 33.0 43.0 j 43.0 56.0 k 56.0 73.0 0 full distribution a a only b b only c c only d d only e e only f f only g g only h h only z a and b only y b and c only w c and d only v d and e only u e and f only t f and g only s g and h only q a, b and c only p b, c and d only n c, d and e only m d, e and f only l e, f and g only k f, g and h only j special color bin 1 a, b, c and d only 2 e, f, g and h only 3 b, c, d and e only 4 c, d, e and f only 5 a, b, c, d and e only 6 b, c, d, e, and f only 0 full distribution a a only b b only c c only d d only e e only f f only z a and b only y b and c only w c and d only v d and e only u e and f only q a, b and c only p b, c and d only n c, d and e only m d, e and f only j special color bin 1 a, b, c and d only 2 e, f, g and h only 3 b, c, d and e only 4 c, d, e and f only 5 a, b, c, d and e only 6 b, c, d, e, and f only amber min. (nm) max. (nm) a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 blue min. (nm) max. (nm) a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 green min. (nm) max. (nm) a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 tolerence for each bin limits is 10 % note: 1. flux bin limit is only applicable for asmt-mx00 component level device only flux bin limit [1] (for reference only) [x 1 x 2 ] color bin limits color bin selections [x 3 ] individual reel will contain parts from one full bin only. cool white warm white
9 cool white color limits [1] (chromaticity coordinates) bin a x y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 bin b x y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.345 bin c x y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 bin d x y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 bin e x y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 bin f x y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 bin g x y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 bin h x y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 warm white color limits [1] (chromaticity coordinates) bin a x y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 bin b x y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 bin c x y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 bin d x y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 bin e x y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 bin f x y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 tolerances 0.01 primary color binning 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 x - coordinate y - coordinate b c e black body curve d a f 4.5k 5.6k 7k 10k 4.0k g h 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 x - coordinate y - coordinate b c e black body curve d a f 3.0k 3.5k 4.0k 2.6k tolerance 0.01 note: 1. color limit and color binning chart are only applicable for asmt-mx00 component level device only
10 cool white (chromaticity coordinates) bin a1 x 0.364 0.367 0.348 0.347 y 0.383 0.400 0.385 0.372 bin a2 x 0.364 0.362 0.346 0.347 y 0.383 0.372 0.359 0.372 bin a3 x 0.329 0.329 0.348 0.347 y 0.357 0.369 0.385 0.372 bin a4 x 0.329 0.329 0.347 0.346 y 0.345 0.357 0.372 0.359 bin b1 x 0.362 0.360 0.344 0.346 y 0.372 0.357 0.344 0.359 bin b2 x 0.360 0.358 0.343 0.344 y 0.357 0.343 0.331 0.344 bin b3 x 0.358 0.356 0.341 0.343 y 0.343 0.330 0.314 0.331 bin b4 x 0.329 0.329 0.346 0.344 y 0.331 0.345 0.359 0.344 bin b5 x 0.329 0.344 0.343 0.329 y 0.331 0.344 0.331 0.320 bin b6 x 0.343 0.341 0.329 0.329 y 0.331 0.314 0.302 0.320 bin c1 x 0.329 0.329 0.315 0.314 y 0.369 0.357 0.344 0.355 bin c2 x 0.329 0.329 0.316 0.315 y 0.357 0.345 0.333 0.344 bin c3 x 0.314 0.315 0.303 0.301 y 0.355 0.344 0.333 0.342 bin c4 x 0.315 0.316 0.305 0.303 y 0.344 0.333 0.322 0.333 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 x - coordinate y - coordinate black body curve 4.5k 5.6k 7k 10k 4.0k a1 a2 a3 a4 b1 b2 b3 b4 b5 b6 c1 c2 c3 c4 d1 d2 d3 d4 d5 d6 g1 g2 h1 h2 h3 sub-color binning (only applicable for color bin a to bin d and bin g to bin h) color limits [1] note: 1. color limit and color binning chart are only applicable for asmt- mx00 component level device only tolerance 0.01 warm white (chromaticity coordinates) bin d1 x y 0.329 0.345 0.329 0.331 0.317 0.320 0.316 0.33 bin d2 x y 0.329 0.331 0.329 0.320 0.318 0.310 0.317 0.320 bin d3 x y 0.329 0.320 0.329 0.302 0.320 0.293 0.318 0.310 bin d4 x y 0.316 0.333 0.317 0.320 0.307 0.311 0.305 0.322 bin d5 x y 0.317 0.320 0.318 0.310 0.309 0.300 0.307 0.311 bin d6 x y 0.318 0.310 0.320 0.293 0.311 0.285 0.309 0.300 bin g1 x y 0.392 0.421 0.386 0.400 0.364 0.383 0.367 0.400 bin g2 x y 0.386 0.400 0.382 0.385 0.362 0.372 0.364 0.383 bin h1 x y 0.382 0.385 0.378 0.370 0.360 0.357 0.362 0.372 bin h2 x y 0.378 0.370 0.375 0.358 0.358 0.34 0.360 0.357 bin h3 x y 0.375 0.358 0.371 0.344 0.356 0.330 0.358 0.343
package tray dimensions handling precaution the encapsulation material of the product is made of silicone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during assembly or handling, the unit should be held on the body (white plastic). disclaimer: avagos products and software are not specifically designed, manufactured or autho - rized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. av02-1086en - april 1, 2009 6.25

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